Intel today added three Intel Atom processors with 7-year lifecycle support to the embedded product line-up. The processors – single-core N450 and D410, and dual-core D510 – feature integrated, enhanced graphics and memory controllers, and are paired with the Intel 82801HM I/O Controller. These processors are ideal for small, energy efficient applications such as those found in industrial, print imaging and digital security surveillance embedded market segments. Demos are being shown on-site at the Intel booth at Embedded World Nürnberg 2010. For more information, see the embedded press kit.

–(Intel)–

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AMD (NYSE:AMD) today expanded its AMD Phenom™ II and AMD Athlon™ II processor families for desktop with several new processors designed to give mainstream consumers advanced performance capabilities from their desktop PCs at increasingly attractive price points. As desktop PCs continue trending toward smaller form factors, AMD remains committed to maximizing the user experience by bringing platform technology integration, efficiency and performance benefits to consumers.

–(AMD)–

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INTERNATIONAL CONSUMER ELECTRONICS SHOW, Las Vegas, Jan. 7, 2010 – Intel Corporation introduced its all new 2010 Intel® Core™ family of processors today, delivering unprecedented integration and smart performance, includingIntel® Turbo Boost Technology for laptops, desktops and embedded devices.

–(Intel)–

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Newest Intel Atom processors are available now as new systems from all the major OEMs begin appearing this week. Watch for a new crop of Intel Atom processor-based netbooks and entry-level desktop PC’s starting today and continuing thru CES and beyond. Pricing for the new CPU’s in 1,000 unit quantities are as follows: N450 for netbooks ($63), and for entry-level desktop the D410 ($43) and dual-core D510 ($64).

–(Intel)–

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SANTA CLARA, Calif., Dec 21, 2009 – Intel Corporation announced new Intel Atom processors today that feature integrated graphics built directly into the CPU, enabling improved performance and smaller, more energy-efficient designs in a new generation of netbooks and Atom-based entry level desktop PCs.

–(Intel)–

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Are you feeling the holiday spirit yet? Check out the Intel Choir’s rendition of the “Twelve Days of Christmas” to help get you in the mood. Wishing you happy holidays filled with wafers, processors and technology galore!

–(Intel)–

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At the International Electron Devices Meeting (IEDM) this week, Intel disclosed new details of its latest process technology, with 32nm feature sizes. It includes Intel’s 2nd generation high-k/metal gate transistors, for even better performance than that reported a year ago. By one measure, known as drive current, transistor performance has been boosted by 5% and 13% for NMOS and PMOS, respectively over results reported at the same conference a year ago. Intel showed that the 32nm technology continues the trend of 0.7x reduction in gate length variation and that the magnitude of both systematic and random within-wafer variation does not increase for the 32nm technology from the 45nm technology. Intel also showed that SRAM array density, which includes memory cells, sense amps and control circuitry, at 4.2 Mbit/mm2, is the highest reported array density for a 32nm or 28nm technology. Intel is in high volume production of 32nm Westmere processors; units are now available to OEMs ahead of planned Q1 2010 introduction.

–(Intel)–

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At the recent ACM Symposium on Operating Systems Principles, Intel Labs researchers were awarded a “Best Paper” award for their report on “FAWN: A Fast Array of Wimpy Nodes (PDF).” The team of researchers, from Carnegie Mellon University and Intel Labs Pittsburgh, combined low-power, embedded processors typically used in netbooks with flash memory to create a server architecture that is fast, but far more energy efficient for data-intensive applications than systems now used by major Internet services. A next-generation FAWN cluster is being built with nodes that include the Intel® Atom™ processor. For more information, see article in ScienceDaily.

–(Intel)–

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Intel and SGI are scaling the extreme heights of supercomputing with a shared memory supercomputer called Altix UV. The system will lead the industry in maximizing bandwidth and minimizing latency on cluster and HPC applications. The system, which is being unveiled at Supercomputing 2009 in Portland, Ore., uses quad-, six-, or eight-core Nehalem-EX processors, and will deliver exceptional performance and scalability. Supercomputing 2009 attendees can see Altix UV in SGI’s booth, #1721.

–(Intel)–

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At Supercomputing 2009 in Portland, Ore., Intel unveiled a future High Performance Computing (HPC) optimized version of its forthcoming processor codenamed “Nehalem-EX.” The six-core chip will run at higher frequencies than eight-core versions of the Nehalem-EX processors and will offer advantages on some HPC workloads. Customers will benefit from greater memory bandwidth and capacity and will be able to build single computers or “nodes” with up to 256 such chips. More details can be found at Intel’s online Press Room.

–(Intel)–

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